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- Virginia Panel Corporation
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Edge Card Adapter, Universal, for .062 PCB
111107138
VPC provides two types of Edge Card Adapter Kits for 10, 25 and 50 Module ITA Enclosures. Both kits are designed for various sized cards.The Universal Edge Card Adapter Kit’s card guides are hinged and can be folded for storage by releasing the holding latches on either side of the card.
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Automated High-Resolution AOI Tool Modular Inspections
LIGHTiX
Next generation macro inspection system (AOI).• All-side wafer inspection: Front, back and edge inspection.• 100% defect images without throughput impact.• Integrated high-end microscope review.• True Color Inspection (TCI) technology.• Advanced CD, 2D/3D, OVL and EBR metrology.• Automatic defect classification• Best in class cost of ownership for high resolution AOI• High-speed patterned wafer inspection• High defect sensitivity• ISO Class 1 certified• Tool – to – tool matching
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Surface Charge and Zeta Potential
Surface analysis is a vital method for qualifying new materials in technical and biological applications. Surface charge analysis empowers users to closely monitor the surface chemistry from small particles in the nanometer range up to large wafers. Gain insights into modifications resulting from surface treatment and surface interactions with natural environments under near-ambient conditions. Get a competitive edge in optimizing existing products and developing new ones using the Anton Paar instruments which offer zeta potential measurement for a wide range of applications.
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Wafer Edge Profile Measurement
WATOM
WATOM can carry out fully automatic, non-contact measurements of the edge profiles and diameter in accordance with SEMICON standards. A special feature is the system's ability to make measurements of the mark cut into the edge of the wafer to indicate the crystal orientation. Because of its high measurement accuracy of less than 1.5 µm, leading wafer manufacturers across the world use WATOM for shop-floor geometrical quality control.
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Wide Measurement Range Model Of Semi-automatic 4 Point Probe Sheet Resistance/resistivity Measurement
RT-3000/RG-2000 (RG-3000)
*User programable measurement pattern & programmable measuring pattern*Tester self-test function, wide measuring range*Thickness, edge, temperature correction for silicon wafer*Film thickness conversion function from sheet resistance*2 types measuring tester (S version: Standard type, H version: High range resistivity measurement type)
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Wafer Sorter and Inspection
SolarWIS Platform
Eliminating the opportunity for problematic wafers to enter cell manufacturing lines greatly improves output and yield. ASM AE’s wafer sorter features 3D area inspection capability to inspect wafer thickness, total thickness variation (TTV), saw marks, as well as wafer bow and warpage. SolarWIS also includes modules that can inspect for stain, geometry, micro-cracks, edge chips, resistivity, P or N conductivity and lifetime.
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Edge Grinding Machines
The requirement for the wafer quality is getting higher and the condition of wafer edge is getting more important. The edge grinders “W-GM series” process edge grinding of various kind of materials such as Silicon, sapphire and SiC.As a solution for that, Our W-GM series are highly rated among manufactures of silicon, compound materials and other wafer shaped materials. Wafer edge grinding machine also draws the attention as a solution for the yield loss due to the knife edge of device wafer in the back end process. In the semiconductor manufacturing process, from the wafer manufacturing to the device manufacturing, the quality improvement of wafer edge is necessary in recent years.We make proposals that achieve the improvement of quality, CoO and yield with our machine.
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Defect Inspection and Review
KLA’s defect inspection and review systems cover the full range of yield applications within the chip and wafer manufacturing environments, including incoming process tool qualification, wafer qualification, research and development, and tool, process and line monitoring. Patterned and unpatterned wafer defect inspection and review systems find, identify and classify particles and pattern defects on the front surface, back surface and edge of the wafer. This information allows engineers to detect, resolve and monitor critical yield excursions, resulting in faster yield ramp and higher production yield.
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WATOM
Wafer edge and notch profile measurementThe use of smaller and smaller patterns in the semiconductor industry calls for increasingly advanced materials of extremely high quality. In response to the steady improvements in the quality of wafers, KoCoS Automation has developed WATOM, a wafer edge and notch profile measurement tool which heralds a new era of extremely precise wafer geometry measurement.WATOM supports quality assurance throughout the wafer manufacturing process, starting at the very beginning and continuing on through to wafer reclaim.The WATOM Edge and Notch Wafer Geometry Analyser sets the worldwide benchmark for the quality assurance of geometrical measurements in semiconductor wafer manufacturing, combining the highest quality standards with top-class service. These high-precision, laser-based edge profile measurement tools are specially designed for optimum integration in manufacturing lines within the semiconductor industry.
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Defect Inspection System
NovusEdge
The NovusEdge System provides high sensitivity inspection for the edge and backside of bare unpatterned wafers for current and advanced nodes. Multiple modules can be configured on the same automation platform for increased throughput while maintaining a small footprint for an improved cost of ownership.
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Defect Inspection Module
EB40
The Class 1 certified E40 and B40 modules (available separately or combined in one module) can automatically detect defects on the entire edge, from zone 1 to 5, and the entire backside. The ability to inspect the entire backside allows for faster root-cause analysis of zone 5 defects since such defects can migrate from the wafer interior.
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Laser Type Edge Detection Sensor
LD
Panasonic Industrial Devices Sales Company of America
The Panasonic LD Series Laser Type Edge Detection Sensor can easily measure the outer diameter of objects. It can also sense inclines, detect the notch of a wafer and judge the height of small objects.
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1000 BASE-T1 Ethernet
MECS-6110
- 1x Intel® Xeon® D-2100 family processor- 4x DDR4-2666 1DPC RDIMM ECC REG up to 256GB- 2x 2.5” SATA bays and 2x M.2 M Key interfaces- 420mm depth 1U 19” rackmount form factor- Built-in Intel® QAT support- TPM 1.2/2.0 modul- 2x IEEE 1588 v2 1PPS/TOD RJ-45 port and 4x 1PPS SMA input/output Specifications- Verified for Intel® Select Solution for uCPE on CentOS
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1U 19” Edge Computing Platform with Intel® Xeon® D Processor
MECS-6120
- 1x Intel® Xeon® D-17XX Series family processor- 3x DDR4-2666 RDIMM ECC REG up to 192GB- 2x 2.5” SATA bays and 2x M.2 M Key interfaces- 420mm depth 1U 19” rackmount form factor- Built-in Intel® QAT: SSL (20G), Compression (15G)- Intel® eASIC by card for FEC acceleration- EMC grade: Class B & Advanced chassis management, IPMI v2.0 compliant
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Edge Gateway
EPC-R4710
EPC-R4710 is an Arm based Box Computer powered by a high-performance Rockchip RK3399 ARM dual Cortex-A72 and quad Cortex-A53 high performance processor which supports 4K display from HDMI. It offers both rich display as dual HDMI and rich IO as dual GbE/6serials/6USB/5GPIO. EPC-R4710 also features Mini-PCIe, M.2, and SIM card slots for integrating Wi-Fi, Bluetooth, and 3G/4G modules. It is an ideal solution for Kiosk, POS, and Vending machine application.
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Edge Gateway
UBC-330
UBC-330 is a RISC computing box powered by a TI Sitara™ AM3352 Cortex®-A8 processor and equipped with 2 Gigabit Ethernet, 5 serial, 4 GPI, and 4 GPO ports. For industrial applications, the serial and GPIO ports feature rugged ESD and isolation protection to prevent system damage from power fluctuations. UBC-330 also supports multiple power input voltages and a wide operating temperature, making it the ideal solution for automation control in smart grid, industrial, and machinery automation applications.
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Wafer Tester
Tokyo Electronics Trading Co., Ltd.
A vital step in the Semiconductor Value Stream, focusing on electrical screening and consumption of Known Good Die (KGD).
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Wafer Mapping Sensor
M-DW1
Panasonic Industrial Devices Sales Company of America
To provide better safety and improved sensing accuracy, Panasonic studied the requirements for future Wafer Mapping Sensors to ultimately develop the LED Beam Reflective Type Wafer Mapping Sensor, M-DW1. This Sensor uses LEDs as a light source for safe operation and a 2-segment receiving element for higher accuracy in wafer detection.
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Edge AI Box
Arm-based edge AI boxes are powered by NXP, NVIDIA and Rockchip. They provide AI inference capabilities in a low-power fanless design.
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Edge Gateway
Arm-based industrial gateways are based on NXP, Qualcomm, Rockchip, and TI, delivering LTE, 5G and Wi-Fi with wide operating temperature range.
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Wafer Chucks
American Probe & Technologies, Inc.
High Performance Chuck for your needs Introducing the American Probe & Technologies’ HC-6000 series of thermal chucks,
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Universal Edge Finder
BORDO
No matter what surface condition may be given, our easy to use BORDO detects various edges in incident light and measures their position. The results of the measurement are transmitted with 1/10 mm resolution via a digital or serial interface to a PC or a PLC which now can place the object into the desired position. This makes BORDO being the perfect tool in many lay-down processes such as the alignment of tiles or other pressed goods. Other applications are checks of alignment. BORDO succeeds even under hard onditions e.g. with missing background, if a thickness of at least 5 mm is given. With its lasercross BORDO is fast and simple adjusted. Another ighlight are the selfregulating algorithms , which optimize parameters of easurement while processing.
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Silicon & Compound Wafers
Compound semiconductors are undergoing a major expansion addressing many new applications and using various materials such as SiC, GaN, GaAs and others, to improve the performance of new devices in several segments such as Power and Face Recognition.
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Edge Intelligence Server
Edge Intelligence Server(EIS) accelerates IoT implementation by providing integrated solutions and software modules that enable IoT connectivity, data manageability and analytics from edge computing to cloud.
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Intelligent Edge Orchestration
Also known as edge orchestration, intelligent edge, or cloud orchestration, the evolving service cluster represents the newest generation of intelligent network-management system (NMS) technologies and capabilities. The edge-orchestration concept, however, runs much broader and deeper than NMS or element management system (EMS), providing far more intelligent, evolved, and numerous capabilities than originally conceived early-on during the technology's development.
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Multi Access Edge (MEC)
The 5G future is open and disaggregated. Gain access to Radisys Edge offerings to accelerate time-to-market and reduce costs by leveraging a full cloud-native solution for virtualized or containerized deployment on any COTS hardware and access to a dedicated network services team.
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Edge Compute Solutions
Innovate in real time. With the world’s largest serverless compute platform, Akamai puts your code closer to your users.
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Wafer Prober Networking System
PN-300
The Wafer Prober Networking System PN-300 utilizes a database to facilitate data access from other systems and provides an environment that enables the user to edit data and handle processing. The system achieves wide-ranging compatibility by adopting standard hardware and operating system. In addition, it is equipped with an N-PAF (Network-based Prober Advanced Function) to provide robust support for wafer prober operation and maintenance.
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Edge AI Acceleration Modules
Powered by Intel® Movidius™ Myriad X VPU and Intel® OpenVINO™ toolkit, Advantech VEGA-300 series provides compact, low power plug-in modules to help accelerate deep learning inference on the edge for a wide range of AI-based and computer vision vertical applications.
