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Failure Analysis
examination of faults, determine root cause and recommend corrective actions.
See Also: Crush, Performance Testing, Investigation
- InterWorking Labs, Inc.
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SilverCreek SNMP Tests
Set up in less than five minutes - Windows or LinuxCustomize tests via Wizards, Script Generators, and moreAutomate operation with unambiguous test resultsIntegrate with other test harnesses and test toolsIncludes conformance, compliance, vulnerability, robustness, stress, and performance testingInvestigate failures and quickly resolve them with powerful diagnostic and analysis tools
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Standard Electromagnetic Vibrator
KD-9363-EM
King Design Industrial Co., Ltd.
The purpose of vibration testing is to make a series of controllable vibration simulation in lab, no matter generated by natural or man-made vibration environment; such as waves, tidal flaps, wind, earthquake or rain and so on. It is to test if the product is capable of sustaining the vibration environment exerted from transporting or usage along its effective life cycle; and certify the standard of design & functional requirement of product. The value of vibration testing is to confirm the reliability of products and effectively screen out the bad products in factory; avoiding damages occurred at arrival; and to assess the failure analysis on the non-performing products; expecting to reach a high standard, high-reliability products. The vibration test stresses on the continuity and fatigue; and contributes to the understanding of product’s status under vibration circumstance in a normal environment; and avoids the product’s unpredictable damage caused under certain vibrating frequency for a long time.
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Field Triage System™
Developed with our customer’s Remote Customer Quality Engineers, who support their customers with rapid in-field failure analysis.
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Failure Analysis – Materials
Failure analysis – materials is the investigation into the background or history of a sample, or an event, to determine why a particular failure occurred. A product failure may include premature breakage, discoloration or even an unexpected odor. It is useful to know if this failure is a new, unique occurrence or if it has been an ongoing issue. The investigation can involve analyzing the sample as it currently exists and extrapolating from that data what may have caused the failure. A sample of the “good” vs. “bad” product may also be useful for comparison purposes.
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Failure Analysis
MicroINSPECT 300FA
The MicroINSPECT 300FA is an automated wafer inspection tool used for semiconductor wafer failure analysis. Its small footprint, high speed, and low cost relative to its rich features yield a superb cost of ownership and makes this an ideal tool for your fab or failure analysis lab. The MicroINSPECT 300FA combines advanced robotics, wafer sorting, an intelligent wafer inspection microscope together with SiteVIEW Software to produce an integrated failure analysis tool.
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Destructive Physical Analysis & Failure Analysis
DPACI's component analysis laboratory performs major analytical functions, such as destructive physical analysis, failure analysis, counterfeit analysis, and material analysis on components & devices. Our destructive physical analysis techniques are performed in accordance with standards and methods used in most military and space program requirements. Solutions for difficult production problems are resolved through our failure analysis procedures.
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PWB Interconnect Stress Test
PWB Interconnect Solutions Inc.
Services to test the reliability of Printed Circuit Boards. PCBs).Coupon Inspection and Electrical Prescreen. Coupon Testing. Failure Location via I/R Photo Imagery. Failure Analysis.
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Predictive Vibration Monitor Solutions
VMU
Vibration Monitor Units (VMUs) from Astronics employ proven vibration analysis to predict the failure of fans and other rotating equipment on passenger and cargo aircraft. Accurate prediction allows maintenance to intervene before a failure can occur, eliminating the resulting smoke or smoke smell event that can result in costly flight delays, diversions, emergency landings, or cancellations.
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FTIR Spectrometers
FTIR spectroscopy is used to quickly and definitively identify compounds such as compounded plastics, blends, fillers, paints, rubbers, coatings, resins, and adhesives. It can be applied across all phases of the product lifecycle including design, manufacture, and failure analysis.
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Cross-Section Analysis Laboratory
PCBs are constructed of a variety of materials such as glass, ceramic, copper, solder and Teflon. Trialon has the equipment and experienced staff to perform this difficult analysis. Our state-of-the-art materials analysis lab located in Auburn Hills, MI is managed by a Ph.D with over 20 years of hands-on experience in root cause failure analysis of design, material and process for current and future products.
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Oil Analyzers
We provide lab instruments, on-site oil analysis systems, and portable tools for a variety of customer needs . Our analyzers provide critical data about machinery condition and can provide an early warning of equipment failure.
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Real-Time X-Ray Imaging and Variable Pressure Scanning Electron Microscope
Trialon has the equipment and experienced staff to operate this highly technical piece of laboratory equipment. Our state-of-the-art materials analysis lab located in Auburn Hills, MI is managed by a Ph.D with over 20 years of hands-on experience in root cause failure analysis of design, material and process for current and future products.
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Surface Insulation Resistance Testing
AutoSIR2™
One AutoSIR chassis can hold between 1 to 16 measurement cards and can monitor up to 256 x 2-point test patterns or 78 x 5-point test patterns, or 32 x 9-point test patterns at selectable intervals from minutes to days. Each channel is current limited (1 M Ω), ensuring that dendrites are preserved for failure analysis. The frequent monitoring capability provides a full picture of the electrochemical reactions taking place on a circuit assembly, and provides early trend analysis enabling tests to be curtailed, thus saving considerable test time and money.
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Vibration Analysis and Balancing Tools
PRÜFTECHNIK Condition Monitoring GmbH
Predictive maintenance tools for vibration analysis can help prevent machine failure and avoid costly production downtime. Our vibration analysis tools are used for condition monitoring on rotating equipment to help detect early component wear and damage. Vibration analysis and balancing are integral parts of any condition-based and predictive maintenance program.
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DI Lab System™
Comprehensive Product Engineering and Failure Analysis Lab system for complete device analysis and physical defect isolation.
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Resistive AC Load Bank
AC load bank testing offers you whole solutions of predictive failure analysis for UPS(uninterrupted power supply), generator, transformers, PV system, inverter etc, to validate the condition and output of such power systems comprehensively. Integrated AC & DC load bank could be made in one unit or separately with different load voltages as per your need for different applications.
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Motor/Generator Test Equipment
Winding ohmmeters RMO-M series measure winding resistance of inductive test objects such as electrical motors and generators. Motor test or generator test of winding resistance is especially important for early-stage failure detection.RMO-M series instruments generate true DC ripple-free current with automatically regulated measurement and discharge process. Even more, test instruments are portable and enclosed in a metal casing.Applications supported by DV Power motor/generator test equipment include:Winding resistance measurement of generators and electrical motorsResistance measurement of high-current bus bar jointsResistance measurement of cable splicesAll of the above-mentioned measurements are performed with the highest accuracy. The advanced DV-Win PC software enables collecting both numerical and graphical results. These features provide an easier and more efficient analysis. After the test, a DV-Win software generates a test report a single click. Finally, a user can easily customize the report and save it in different formats, such as XLS and PDF.
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Test System
Griffin III
The Griffin III system brings new price/performance efficiency to the Tester-in-a-Head tradition, a concept created and introduced by HILEVEL in 1987. This tester is a superior cost-effective solution for Engineering, Production, and Failure Analysis test applications.
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ADLINK Software
The plug and play Edge IoT solution for machine condition monitoring enabling remote equipment monitoring, health scoring and predictive failure analysis to maximize overall equipment effectiveness (OEE).
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Materials And Chemical Analysis
Anderson Materials Evaluation, Inc.
Materials characterization, failure analysis, quality control, and materials and process development services are offered. Our analytical techniques allow us to assess elemental and chemical material composition, thermal properties, coating thickness, electrochemical properties, surface chemistry, surface wetting, corrosion rates and pitting potentials, contamination and degradation problems, metallography, fractography, phase transitions, static coefficient of friction, adhesive bonding strength and causes of adhesive bonding failures, surface tension and surface energy, tensile and compressive strength, bend deflection, lapshear strength, elasticity properties, UV and visible light absorption and reflection, density and porosity, and many other material properties integral to improving your products.
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Battery Pack/Module Test Solution
Regenerative battery energy dischargeEnergy savingEnvironment protectionLow heat generateChannels paralleled for higher currentsCharge / discharge mode (CC, CV, CP) Constant current Constant voltage Constant powerDriving cycle simulationHigh precision measurement accuracyFast current conversionSmooth current without over shootTesting data analysis functionData recovery protection (after power failure)Independent protection of multi-channelBMS data recordingThermal chamber control integration
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Component Test and Analysis Laboratories
The Component Test and Analysis team specializes in electronic and mechanical components such as hybrids, connectors, cables, harnesses, passive or discrete components, and digital or linear devices. The test lab has extensive experience in developing test software to electrically and environmentally characterize virtually any integrated circuit, including analog, digital, mixed signal, converters, FPGA and ASICs, as well as experience in developing actual radiation environments for parts testing. The component analysis team offers the analytical expertise and advanced instrumentation to identify root cause explanation for a wide range of component-level failures, as well as the resources to evaluate for possible quality and reliability issues through non-destructive and destructive techniques. With access to a detailed database, the Component Test and Analysis team offers a 25-year history of test and analysis data — a valuable resource for addressing new customer requirements.
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Analytical Probe Station with Laser Cutting System
LCS- 4000 Series
The LCS-4000 Probe Station with Integrated Laser Cutting System gives the user maximum flexibility in semiconductor diagnostic cutting, failure analysis, trimming, marking and topside layer removal. All of these functions can be performed on a microscopic level, all on this one system which provides a high level of performance that is remarkably easy to use.
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System Modeling for Diagnostic Design and Analysis
EXpress
eXpress is a comprehensive model-based diagnostics engineering software application providing an environment for the design, capture, integration, evaluation and optimization of complex or large-scale system diagnostics, prognostics health management (PHM), systems testability engineering, failure mode and effects analysis and system safety analysis. eXpress is uniquely suited to influence the diagnostic development for new designs or to exploit the diagnostic challenges of existing legacy systems. Its robust structure facilitates the capture of extensive interdisciplinary design knowledge providing an unmatched ability to corroborate, reuse and re-purpose expert knowledge in performing standardised testability, reliability and maintainability analyses.
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Thermal Image Analysis Software
Thermalyze
Thermalyze software provides a stable platform from which to perform sophisticated temperature analysis and failure analysis testing. Tools such as Emissivity Tables allow you to perform true temperature mapping on the surface with varying emissivity. Lock-in thermography tests enable you to detect heating below 0.001°C.
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X-ray Inspection Performance
MXI Quadra 7
Ultimate image quality and magnification, Quadra 7 reveals quality defects as small as 0.1 µm. Ideal for root cause failure analysis, wire bond integrity checking, component cracking, MEMS inspection and wafer level components including TSV and wafer bumps.
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Scanning Electron Microscope w/ EDX Laboratory
Trialon has the equipment and experienced staff to operate this highly technical piece of laboratory equipment. Our state-of-the-art materials analysis lab located in Auburn Hills, MI is managed by a Ph.D with over 20 years of hands-on experience in root cause failure analysis of design, material and process for current and future products.
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Microscopy Software Suite/IC Diagnostics
Crystal Vision
Crystal Vision Microscopy suites are transforming the world of IC Diagnostics and failure analysis. Intuitive software allows user friendliness and enables the breadth of analytical disciplines available. Realtime imaging from both Topside and Backside, allows for maximum productivity.
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Mechanical Tester
NANOVEA Mechanical Tester is the most versatile nanoindenter and scratch tester capable of precisely measuring the micro- to nanomechanical properties of wide ranges of materials from thin films, coatings, ceramics and composites to polymers and bio materials via Indentation, Scratch and Friction testing. All NANOVEA Mechanical Tester models come with true feedback load control from independent load and depth sensors that provide unmatched accuracy and the highest repeatability available on the market. This technology allows a user to perform Nanoindentation and Microindentation for Hardness and Elastic Modulus Testing, Stress vs Strain Analysis, Creep and Relaxation, Loss and Storage Modulus, Yield Strength and Fatigue, Fracture Toughness and Nano-scratch & Micro-scratch for Scratch Hardness Testing, Multi-pass Wear Test, Cohesive and Adhesive Failure Testing as well as Coefficient of Friction testing, all available on one system.
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Microelectronic Services
Services for ASIC houses and Integrated Device Manufacturers are IC Wafer / Final Test, IC assembly, Test Program development, product engineering, Flash / EEPROM programming, characterisation / capability studies, yield enhancement, design verification and failure / yield analysis. Das Test Haus are specialists for wafer test, low power, mixed signal and eeprom test.
