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- Virginia Panel Corporation
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Module Accessory Kit, Quantity 26 2-56 x .25" Socket Head Cap Screws Stainless Steel
510109375
Used with modules: 510104306.
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Test & Burn-In Socket for Devices up to 13mm Square
CSP/MicroBGA
Test & Burn-In Socket. Socket is easily mounted and removed to & from the BIB due to solderless pressure mount compression spring probes which, are accurately located by two molded plastic alignment pins and mounted with four stainless steel screws. Standard molded socket format can accommodate any device package of 13mm or smaller, by using machined (for small quantities) or custom molded (for large quantities) pressure pads and interposers.
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QFN/QFP35 Sockets
Test sockets are designed for testing today’s high-performance QFN, QFP, DFN and SOIC devices. For development, characterization, at speed burn-in, and low volume production manual testing.
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Semiconductor
With ultra-multi pin count and fine pitch, our general-purpose IC socket lineup corresponds to every need. For semiconductor burn-in sockets for thermal acceleration tests, and test sockets for semiconductor electrical testing, we continue to hold a high market share all over the world.
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Stamped Spring Pin Sockets
Ironwood Electronics SBT sockets are small footprint sockets that are compatible with other product lines such as GHz elastomer sockets, Giga-Spring sockets, etc. The socket needs about 2.5mm extra space around the chip than the actual chip size utilizing only very small PCB real estate. A heat sink screw on the top provides the compression force as well as thermal relief and can be customized to dissipate more power. SBT socket uses SBT contact technology for high endurance and wide temperature applications. SBT Contact is a stamped contact with outside spring as well as inside leaf spring that provides a robust solution for Burn-in & Test applications. Solutions are available for 0.3mm to 1.27mm LGA, BGA, QFN, QFP, SOIC and other packages. Contact technology has 3 part system which includes top plunger, bottom plunger and a spring. The Beryllium Copper plungers are stamped and assembled to a stainless steel spring in an automated system to enable fast turnaround time, low cost and zero defects.
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Burn-In Test Sockets
The selection of the test socket is critical to the performance of a device during qualification testing where electrical bias and signals are applied. Key factors such as mechanical compatibility, operating temperature, ability to withstand high moisture levels, signal speed and lead inductance/capacitance all need to be taken into account when selecting the best socket for the test application.
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Open Top BGA Sockets
Ironwood has the most comprehensive collection of open top BGA and QFN sockets that can be used for qualification application, silicon FIB testing, system development, thermal characterization, burn-in application, etc. IC socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. Typical packages include BGA, LGA, QFN, QFP, WLCSP, etc. Open top allows access to the top side of IC. Below is an example BGA socket that uses low cost elastomer contact technology.
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BGA Sockets
Ironwood has the most comprehensive collection of BGA (Ball Grid Array) sockets that can be used for prototype application, silicon validation, system development, thermal characterization, burn-in application, functional production test, etc. BGA socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. BGA sockets for prototype applications, silicon validations, system development applications uses low cost elastomer contact technology.
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LGA Sockets
We’ve taken our QFN expertise and combined it with the versatility and performance of the H-Pin® to leverage an LGA socket platform that serves the demanding requirements of today’s market. Plastronics LGA sockets using the H-Pin provide a high-performance socket that is affordable for all burn-in operations. These LGA sockets meet the power, temperature and signal performance needs of the higher density, larger package outline, and sometimes mix-pitch LGA designs. The LGA platform serves package sizes from as small as 2.0mm X 2.0mm to the industry’s largest standard socket for 60.0mm X 60.0mm packages.
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Burn-in and Test Sockets
Loranger International Corporation
Loranger International Corporation designs and manufactures thousands of socket styles for the burn-in and test of semiconductors and electronic components. Some of the socket styles are listed below.
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Burn-In Test
C.C.P. Contact Probes Co., LTD.
Customized Burn-In Test Sockets for temperatures of up to 180°C.
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Burn-In Board Tester
Focus-275
Focus275 is a tester for burn-in board.It can improve reliability of burn-in board by inspecting boards for burn-in test by Focus275 regularlyBoth short open test and component test can be done by sending electric signals for special socket contactor and edge part.
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Burn-In Boards
Manufacture of burn-in boards since 1976. Established for more than 40 years in the market, Trio-Tech is recognized and is an approved global supplier to all major semiconductor companies. Trio-Tech has the capability to design and manufacture boards for all system types, with solutions available for many test conditions, Including HTOL, PTC, HAST and 85/85.
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Burn-In Test Fixtures
Burn-in generally involves the extended operation of a product in a temperature-controlled environment. With possible humidity and supply voltage margining - the burn-in process can then be extended to include power stress (levels and on/off cycles) tests, high humidity environmental simulation as well as the classic "four corner test" of high voltage + high temperature, high voltage + low temperature, low voltage + high temperature and low voltage + low temperature.
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BIB Loading
FALCON Series
The Falcon Series is an automated BIB loading and unloading machine. It is designed to provide precise high-speed loading of DUTs from Trays/Tube to Burn-in boards and precise high-speed unloading of DUTs from Burn-in boards to Trays/Tube for different device packages. The Falcon Series also has a simple conversion kit which allows end-users to re-configure the equipment for different types of sockets and package combinations.
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Memory Burn-In Tester
H5620/H5620ES
As Server and Mobile applications have mainly led the Memory and market has also entered a super cycle that has completely withdrawn from the previous silicon cycle.Memory capacitance will continue to rise as the application of data processing and mobile communication occurs—however, revenue will not grow as ASP goes down. Suppliers need to reduce test costs and increase profits.H5620 contributes to reduction of test cost by integrating the test process of DRAM Burn-in and Core Test. This hybrid memory test solution solves the challenge of reducing test costs while increasing test efficiency in the expanding DRAM market.
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Test Sockets
Yamaichi Electronics Co., Ltd.
A test socket is the ideal point to test your home’s internal phone wiring for faults. You can also use it to identify any potential faults with the phone line outside. Your test socket is located in your master socket. It is the point between the internal phone wiring in your house and the phone line outside. That means by plugging into your test socket you can bypass all the internal wiring and test your device directly on the phone line.
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Memory Burn-In Test
The N3500 is Neosem Technology’s fourth generation memory test system. Specifically designed for Flash Components and Flash Cards, the N3500 tester-on-a-board architecture targets the broadest range of DUT technologies in various form factors and packages. Each Tester Board (or “Blade”) contains 288 I/O pins and 32 DPS supplies.
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Burn-in and Stress Screening Chambers
KDR
Supervise the operation of your product, electronic device, circuit board, or medical device while they are stress screened, burned-in, or temperature cycled inside a Bemco Kardburn or Koldburn glass front chamber. With a huge amount of testing or storage space within instant reach, KD Chambers provide a compact and attractive alternative to a walk-in chamber.
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Burn-in Systems
Incal Offers A Line Of State-Of-The-Art Burn-In Testing Hardware And Software For Retrofit And/Or Total, Customized Burn-In System Configurations.
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Burn-In System
The COBIS-II Series Burn-in System is designed to test the latest high frequency integrated circuits (ICs) and combines a large capacity oven with well proven Accutron FlexBID™ dynamic driver technology. This system is engineered for productive dynamic device testing and reliable monitoring.
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ATE Socket
Design ATE socket according to customer's requirementsUse on auto-test eqiupments and handler.Pitch range from 0.30 to 1.0mm.Pin amount: 2 and above.Key material: Peek,Torlon.etcContact with top pogo pin
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GFCI Socket Tester
TEL5
Standard Electric Works Co., Ltd
● Fast, easy wiring check.● Easy to read light indication.● Confirm the correct wiring of AC socket.● Test GFCI for correct wiring & operation.● Detect 5 wiring faults.● GFCI circuit trips to confirm the tester is working.● The testing current for GFCI is about 8mA.
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Power Tube Burn-in Station
Maxi-Burn
The MaxiBurn Tube Preheater is a 2U rack mountable or bench top unit for heating 30 Octal Base Tubes. Designed for continuous use heating standard power pentodes to normalize their characteristics before testing or matching the MaxiBurn powers the tube filaments and drives a nominal plate current through each tube. Normal function of each tube is indicated by a glowing LED associated with the tube.
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LED Burn-In Test
Burn-in system, based on LXI instrumentation, for concurrent testing of up to 80 DUTs in a climatic chamber. Devices to be tested include modern light emitting diodes and LED modules.The system consists of 2 control cabinets, each with 40 independent supply and measurement channels. Each channel can be configured individually via the operator software (current or voltage, including the relevant limit values). The software supports logging of current and voltage values for each DUT on all 80 channels with a sampling rate of <1s. Additionally, the software and system also support digital I/O channels, e. g. for controlling the climatic chamber. Inputs for connecting temperature sensors are also provided.
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Test Sockets
MEMS Device
Patented MEMS Sockets from Ardent Concepts use a unique scrubbing action contact set which is ideal for today’s sensitive MEMS devices, including accelerometers, gyroscopes, MEMS microphones and other specialized devices used in mobile electronics applications
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RF Bias Burn-In System
These systems deliver an unbeatable combination of advantages over a wide range of RF frequencies and power levels. The Automated Multi-Channel RF-Biased Burn-In Test System is a turnkey system that incorporates all of the capability needed for accelerated aging and parametric testing of RF semiconductor devices. Its powerful software elegantly supports data acquisition, storage, and presentation. Accel RF’s customers choose system features to meet their technical needs and capital budget. In addition to cost savings, use of Accel-RF’s solutions accelerate product time-to-market, saving many months of product development.
