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Wafer Mapping
Identify semiconductor performace across a wafer.
See Also: Wafer, Mapping, Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Probes, Wafer Probers, Wafer Inspection, Wafer Maps
- Scientific Test, Inc.
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Automated Discrete Semiconductor Tester (ATE)
5000E
Same Proven Technology as all 5000 Series Testers. High Speed Single Test Measure. Capable of Testing Multiple and Mixed Devices. 1KV Standard, 2KV Optional. 1NA to 50A Standard, 100A Optional. 0.1NA Resolution. Complete Self Test. Auto-Calibration. RDSON to 0.1MOHM Resolution. Windows Application Software. Optional Scanner. Optional Wafer Mapping. Optional Curve Trace. MOSFET, IGBT, J-FETTriac, SCR, Sidac, Diac, Quadrac, STS, SBS Transistor, Diode, Opto, Zener Regulator, MOV, Relay. UNDER $23,000.00
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Wafer Mapping Sensor
M-DW1
Panasonic Industrial Devices Sales Company of America
To provide better safety and improved sensing accuracy, Panasonic studied the requirements for future Wafer Mapping Sensors to ultimately develop the LED Beam Reflective Type Wafer Mapping Sensor, M-DW1. This Sensor uses LEDs as a light source for safe operation and a 2-segment receiving element for higher accuracy in wafer detection.
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Micro-spot DUV Spectroscopic Reflectometry
FilmTek 2000 PAR
Scientific Computing International
A low-cost solution for high-throughput, fully-automated mapping of patterned wafers for development and production environments. Utilizes patented parabolic mirror technology to measure wavelengths from DUV to NIR with a spot size as small as 13µm. Fully user-customizable wafer mapping capabilities rapidly generate 2D and 3D data maps of any measured parameter.
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Motion Control Components
- Control of versatile robotic structures, including "yaw", "pitch" and "roll" motion capabilities- S-curve velocity profiling, based on polynomial splines and Bernstein-Bezier curves- Continuous path control in multi-segment smooth trajectories- Synchronization of multiple axes- Trajectory control with user defined velocity profiles- Kinematical modeling of open and closed loop mechanisms- Singularity consistent path planning and singularity avoidance- Optimal PID filter tuning- Automatic adjustment with respect to the surrounding equipment (cassettes, process stations, etc.)- Tilting capabilities in terms of the end-effector frame- Compensation for deflection of the end effector, the manipulated object and geometric in accuracies of the arm Scanning and Aligning Features- Wafer mapping based on through-beam or reflective sensors- Automatic detection of the planarity and the center of wafers and FPD- Non contact FPD aligning. Misalignment compensation on the fly Safety- Programmable travel limits- Position tracking error detection- Amplifier overload protection- Emergency stop
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DUV-NIR Spectroscopic Reflectometry
FilmTek 2000
Scientific Computing International
Automated metrology system designed for rapid, reliable, and accurate characterization of nearly any unpatterned thin film. Fully user-customizable wafer mapping capabilities rapidly generate 2D and 3D data maps of any measured parameter. Capable of simultaneous determination of multiple film characteristics within a fraction of a second per site.
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Bow and Global Film Stress Measurement
128 Series
Bow and Global Film Stress Measurement.Non-contact full wafer stress mapping for semiconductor and flat panel application.Dual Laser Switching Technology.
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Epi Thickness & Composition System
Element
The Element system is the tool of record for wafer suppliers for high speed impurity mapping and epi thickness measurement. It is the only tool on the market with the unique combination of transmission and reflection based technology. This system is the industry standard for dielectric monitoring.
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Wafer & Die Inspection
SemiProbe wafer inspection system (WIS) examines, locates and identifies defects created during wafer manufacturing, probing, bumping, dicing or general handling. This provides microelectronic device manufacturers with accurate, timely quality assurance and process information. The WIS has single sided and double sided wafer mapping capabilities and can improve efficiency, reduce manufacturing costs, increase yields and shorten time to market.
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kSA Scanning Pyro
For use on Veeco K465i and EPIK700 MOCVD reactors, the kSA Scanning Pyro performs automated temperature mapping in order to measure temperature variations across wafer carriers and wafers. Use it to tune heater zones and optimize process and hardware to achieve higher yields, wafer uniformity and device performance.
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Semiconductor Technology, Micro Scriber + Meters For Contact Angle And Surface Tension
SURFTENS WH 300
Optik Elektronik Gerätetechnik GmbH
The leading equipment for professional use in 200 and 300 mm wafer processing in semiconductor technology. SURFTENS WH 300 is equipped with a 3 axis wafer robot, wafer scanner, loadport for 200 and/or 300 mm wafers, fan filter unit, notching system. Suitable for any cleanroom class it features the automatic mapping of contact angles on wafers for up to 25 wafers.New: with SECS/GEM Interface!
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Pressure Mapping
CONFORMAT® SYSTEM FOR R&D
Tactile pressure measurement system utilizing a fully conforming array pressure sensor.
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Half-Cell Corrosion Mapping
XCell
Giatec XCell™ is a smart tablet-based NDT probe for fast, accurate and efficient detection and on-site analysis of corrosion in reinforced concrete structures. Giatec XCell™ meets all the requirements of the ASTM C876 standard specification.
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Pressure Mapping
WIPER
Evaluate wiper blade force profiles and interface pressure distribution.
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Professional Mapping Drone
eBee Plus
eBee Plus system includes: long-flying fixed-wing airframe; photogrammetry-optimised RGB sensor; next-gen flight & data management software . The eBee Plus can map more square kilometres per flight. The eBee Plus includes built-in RTK/PPK functionality that can be activated either out of the box or later when required. The eBee Plus offers a camera to suit every application, including the senseFly S.O.D.A. (supplied), the first camera designed for photogrammetric drone mapping.
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Wafer Tester
Tokyo Electronics Trading Co., Ltd.
A vital step in the Semiconductor Value Stream, focusing on electrical screening and consumption of Known Good Die (KGD).
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Pressure Mapping
NIP PRESSURE MEASUREMENT SYSTEM
A completely wireless system for measuring nip pressure between rollers in real-time
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Photoluminescence Mapping System
VS6845A
Industrial Vision Technology Pte Ltd.
With its unique optical design technology, the System detects and classifies defects that affect yield and uses advanced photoluminescence (PL) technology to enable real-time monitoring of MOCVD production processes.
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Wafer Chucks
American Probe & Technologies, Inc.
High Performance Chuck for your needs Introducing the American Probe & Technologies’ HC-6000 series of thermal chucks,
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Silicon & Compound Wafers
Compound semiconductors are undergoing a major expansion addressing many new applications and using various materials such as SiC, GaN, GaAs and others, to improve the performance of new devices in several segments such as Power and Face Recognition.
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Pressure Mapping
HIGH SPEED I-SCAN® SYSTEM
Tactile pressure and force measurement system capable of measuring
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Wafer Prober Networking System
PN-300
The Wafer Prober Networking System PN-300 utilizes a database to facilitate data access from other systems and provides an environment that enables the user to edit data and handle processing. The system achieves wide-ranging compatibility by adopting standard hardware and operating system. In addition, it is equipped with an N-PAF (Network-based Prober Advanced Function) to provide robust support for wafer prober operation and maintenance.
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Concrete Corrosion Mapping System
15620
Our Concrete Corrosion Mapping System (CCMS) can be used to satisfy the ASTM C-876 standard test method and the kit contains all equipment items that are needed to perform a corrosion survey on virtually all types of reinforced concrete structures, such as bridges, highway slabs and parking garages.
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Pressure Mapping
TIRESCAN
Complete pressure imaging system for conducting tire tread analysis.
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Batch Wafer Transfer Tools
Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises Batch Wafer Transfer Tools
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Wafer Thickness Measurement System
MPT1000
Laser based Wafer Thickness and Roughness Measurement System designed by Chapman Instrument Inc., USA and OEM by Creden Mechatronic Sdn Bhd. A non-contact measurement system measures several parameters in a single system. (wafer & tape thickness, roughness, TTV, bump height, bow and warp measurements)
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Wafer Bonding Systems
ith over 15 years experience in designing and manufacturing precision wafer bonding equipment, EVG wafer bonding systems are well recognized in setting industry standards for the MEMS production industry. Besides supporting wafer level and advanced packaging, 3D interconnects and MEMS fabrication, the EVG500 series wafer bonding systems can be configured for R&D, pilot-line or volume production. They accommodate the most demanding applications by bonding under high vacuum, precisely controlled fine vacuum, temperature or high pressure conditions. Multiple bonding methods including anodic, thermo compression, glass-frit, epoxy, UV and fusion bonding are covered. Based on a unique modular bond chamber design the EVG500 series allow for an easy technology transfer from R&D to high volume production.
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Wafer Edge Profile Measurement
WATOM
WATOM can carry out fully automatic, non-contact measurements of the edge profiles and diameter in accordance with SEMICON standards. A special feature is the system's ability to make measurements of the mark cut into the edge of the wafer to indicate the crystal orientation. Because of its high measurement accuracy of less than 1.5 µm, leading wafer manufacturers across the world use WATOM for shop-floor geometrical quality control.
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Wafer Chucks
ARC, in addition to fabricating Wafer Chucks from aluminum, is also known for its ability to work in hard to machine materials such as hardened (50-62 Rockwell) metal alloys, fired ceramics, e.g. SiC and glasses. These materials are often ideal for semiconductor equipment applications due to their ability to hold critical dimensions and tolerances. ARC specializes in surface grinding and lapping these materials to precision flatness and parallelism specifications needed for semiconductor wafer chuck requirements.
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In-situ Wafer Temperature Monitoring
CI Semi's family of noncontact temperature monitors (the NTM line), offers high end pyrometry products for the measurement of wafer temperatures during process. CI Semi’s flag ship of the line, the NTM Delta, incorporates real-time, same point emissivity measurement and compensation making it the ideal solution for in situ monitoring for processes such as RTP, CVD and PVD. The NTM family is sold to leading tool manufacturers.
