Rhesca Co., Ltd.
Manufactures and sells strength testers that measure solder joint strength and bonding strength in the semiconductor assembly process, and surface property testers that evaluate thin film adhesion and frictional wear.
- +81-(0)42-582-4711
- +81-(0)42-589-4686
- 1-15-17 Hinohonmachi
Hino City
Tokyo Prefecture, 191-0011
Japan
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product
Solder Wettability Tester
5200 Advanced
This is an ultra-high-sensitivity wettability tester developed to evaluate the solder wettability of ever-miniaturizing electronic components. Electronic devices, especially mobile devices, are becoming more compact and multi-functional. As the number of electronic components mounted on them increases and the pitch of connectors that connect each device increases, soldering parts are becoming increasingly miniaturized. expected to respond to further miniaturization of electronic components and miniaturization of joints in the future .
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High Load Shear Strength Tester
HLST1000
This tester measures the shear force required to analyze the bonding strength of various bonding materials. It is possible to measure shear force up to 5000N for the purpose of bonding strength evaluation over a large area. An optional heating unit enables evaluation while the sample is heated.
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product
Sliding Peel Strength Tester
OST3000
Compared to the scratch test, the friction and wear test is considered to be a durability evaluation method that is closer to the actual situation
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Thermal Conductivity Measuring Device
TCM1001
In recent years, there has been a demand for small and thin electronic products such as mobile devices, and printed circuit boards are shifting to thin, multi-layered, and even modularized printed circuit boards. effect of bonding materials, that is, the ability to easily conduct heat, is emphasized, and testing equipment that evaluates thermal conductivity is required .As a business of our company, we have mainly manufactured and sold test equipment for solder wettability tests and solder bonding strength, but there was a need to urgently develop next-generation bonding material test equipment to replace these. Under these circumstances, we received a request from an academic research facility to manufacture a device that can measure the thermal conductivity of conductive adhesives under research and development, and we were able to obtain an opportunity to develop the device. We proceeded with the development based on these requirements .
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High Load Strength Tester
HLST1000Z
This tester measures the tensile or compressive strength of various samples
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product
Solder Wettability Tester
5200ZC
The current machine (5200TN) was developed as a comprehensive machine that covers solderability test standards around the world, but we have added a high cost performance machine to the lineup that has realized the request of "single function + low price", which many people who are using the successive machines of SAT2000-5000-5100 type.
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product
Ultra Thin Film Scratch Tester
CSR5100
The micro-scratch method (JIS R-3255), which is an evolution of the scratch method that evaluates the adhesion strength between the thin film formed on the material surface and the base material, enables the detection of peeling of thin films. detection, we have a highly sensitive destruction detection mechanism based on our own patented technology (Patent No. 5070146) to evaluate the adhesion strength of ultra-thin
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product
Solder Wettability Tester
5200TN
Amid the rapid progress in miniaturization of electronic components in high-density mounting, a long-established company that has been manufacturing solder wettability testers for about 40 years has developed a solder wettability tester compatible with the latest micro electronic components. and is the top model in the history of solder checkers with improved operability. * Wetting stress is proportional to the circumference of
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Seam Fold Test Device
FFR1000
This equipment is designed to bend a flexible printed circuit board, which has a high degree of freedom and versatility, and at that time, apply a load to the bending point at the initial stage or each time, and repeat bending and unfolding to confirm the durability.
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product
Hydrophobic Powder Wettability Tester
WET1001
We will introduce a hydrophobic powder wettability tester that measures the critical wetting tension of powder materials such as pharmaceuticals and pigments and considers dispersibility and surface energy. flow rate concentration curve .The amount of organic solvent when this powder lump starts to settle is evaluated as a measure of the degree of affinity (hydrophobicity) with the organic solvent.
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Repeat Durability Tester
TIQ1000
It is a device to measure repeated endurance such as limit bending test of board, endurance test of mounted board, endurance test of connector, etc. Continuity data and load data can be obtained during the cyclic endurance test. Conforms to JEITA ET-7407 "Environmental and durability test methods for mounted CSP/BGA packages".
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product
Scratch Tester
CSR1000
This tester is highly effective in measuring the adhesion strength (adhesion strength) of hard coatings (Ti, TiN, SiC, DLC, etc.) formed by PVD and CVD on metal surfaces such as cemented carbide. Adopting a scratch test method that allows quantitative measurement with simple operations, the film surface is scratched while increasing the load on the sample surface, detecting film breakage with high sensitivity, and providing the load at which film breakage occurs (critical load). tools and mold tools that require
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product
Friction Player
FPR2200
The friction coefficient is measured by the pin-on-disk method. Also, by measuring the coefficient of dynamic friction, surface destruction occurs due to wear and changes in the coefficient of dynamic friction occur .This machine is the latest model that was created by realizing various measurement modes, improving data resolution, and pursuing ease of use based on the achievements cultivated in the friction and wear tester that we have manufactured and sold in the past.
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Hot Dipping Simulator
HDPS
This is a hot-dip galvanizing simulator that simulates various hot-dip galvanizing processes such as heating, cooling, vacuuming, gas replacement, and spraying of steel sheets on a laboratory scale. It is possible to simulate the parameters close to the actual line, such as zinc bath temperature, immersion speed, immersion time, and gas flow rate adjustment for weight control. Also, 20 to 25 sheets can be tested
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Rolling Displacement Measuring Device
ASR01
This device is used to dynamically measure the displacement and load that occur when a specific sample is pressed down using a flat indenter, and to help analyze the phenomenon and the potential capacity of the sample.
